a wafer metrology consortium under MAGNET

<span>THE</span> 450mm

THE 450mm


Advancing 450mm metrology 


According to ITRS, the expectation is that in 2018, chip manufacturers will start moving toward high-volume manufacturing (HVM) with 450mm wafers. Already today, these manufacturers are building pilot lines and readying facilities for this purpose. Israeli metrology companies plan on being at the forefront of this revolution.

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The primary reason of moving to 450mm is cost; the 450mm manufacturing tools must be faster to enable more dies out, Such a change lead to a concomitant requirements in significantly updated metrology tools. It is this major step in chip manufacturing which the Metro450 consortium wants to utilize as a slingshot far advancing Israeli-based metrology companies.

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Already today (in 2013), the large computer chip manufacturers are working on pilot lines for the 450mm wafer production. Based upon published reports, by 2018, at least some of these manufacturers will move toward high-volume manufacturing of chips on this wafer size.

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Israeli metrology companies are fierce competitors. How are they able to get together in such a consortium? The answer lies in the type of knowledge they share. No information is shared that is machine-specific. Details about how the measurements are done are not shared. Instead, non-core-IP is revealed. The cooperation lies in cooperation in pre-competitive issues, such as those described in the work packages.

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Around the world

Metro450 is an Israeli consortium which is cooperating with international consortia, including G450C, based in Albany, NY, and with several European projects, such as 450EDL and 450PR under the aegis of ENIAC. Metro450 Israel welcomes additional cooperation with similar bodies around the world.

News and Events

The organizations announce a five-year extension of their research collaboration at the Centre of Excellence in Advanced Packaging in Singapore
Fan-Out Wafer-Level Packaging is a key technology inflection in the semiconductor industry expected to help make chips and end-user devices smaller, faster and more power efficient
Joint R&D Centre set to meet growing demand for use of fan-out multi-die packaging in mobile devices

AU: Michael Ney, Avner Safrani and Ibrahim Abdulhlaim

SO: Journal of Optics, 2016
Advanced Defect Discovery and Process Monitoring Address 10nm Yield Challenges
K-Means over Incomplete Datasets using Mean Euclidean Distance

AU: Loai AbdAllah and Ilan Shimshoni
Lookahead Selective Sampling for Incomplete Data

AU: Loai AbdAllah and Ilan Shimshoni
Performance and Applications of L1B2 Ultrasonic Motors

AU: Gal Peled, Roman Yasinov and Nir Karasikov / Nanomotion
SO: Actuators 2016
On Energy-Optimal and Time-Optimal Precise Displacement of Rigid Body with Friction

AO: Ilya Ioslovich, Per-Olof Gutman, Ari Berger, Shai Moshenberg
SO: Journal of Optimization Theory and Applicationsתת pp 1-15
On the optimal control of the rigid body precise movement: Is energy optimality the same as time optimality?

AU: Gutman, P.-O., Ioslovich, I., Moshenberg, S.
SO: SIAM Conference on Control and Its Applications 2015
Time optimal trajectory planning with feed- forward and friction compensation

AU: Berger, A., Ioslovich, I., Gutman, P.O.
SO: American Control Conference (ACC 2015) Proceedings, Chicago, IL, USA, pp. 4143-4148
On the energy-optimal precise wafer stage positioning: Equivalence with minimal time optimality

AU: Ioslovich, I., Moshenberg, S., Gutman, P.O.
SO: Proceedings of 24th International Symposium on Industrial Electronics (IEEE ISIE 2015), June 3-5, Buzios, Brazil, pp. 95-99
Identification and modeling of contact dynamics of precise direct drive stages

Authors: Michael Feldman, Yaron Zimmerman, Michael Gissin and Izhak Bucher
Source: Journal of Dynamic Systems, Measurement, and Control, 2016
On the slow dynamics of near-field acoustically levitated objects under High excitation frequencies, Journal of Sound and Vibration

Authors: Dotan Ilssar, Izhak Bucher
Source: Journal of Sound and Vibration, Volume 354, 13 October 2015, Pages 154-166
Nonlinear vibrating system identification via Hilbert decomposition

Authors: Michael Feldman, Simon Braun
Source: Mechanical Systems and Signal Processing, 2016
The industry delays plans for 450mm wafers, and Metro450 consortium targets its innovative technologies to the 300mm production lines

Work Packages


WP 1: Wafer Handling / Chucking / Stepping

Work package 1 addresses the challenges for moving the wafer quickly and efficiently. The overall speed of movement is dependent upon both the physical movement and the settling time.

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WP 2: Sampling Optimization

In order to determine if there are defects in the production of the dies, many points on the wafer are examined. Perhaps there is a better, more efficient method for determining just how many points really need to be checked. The goal of WP2 is to find more efficient sampling strategies than exist today.

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WP 3: Wafer Damage and Contamination

With the larger wafer size and smaller critical dimensions of the 450 wafers, damage and contamination control become serious challenges. WP 3 attempts to determine the cause of some of the damage, and researches methods to reduce contamination in order to meet stringent specifications for the 450mm wafer era.

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WP 4: 450mm Standard Calibration Wafer

It is the goal of WP4 to bring forth an industry-wide standard metrology calibration wafer. Such a wafer would help in monitoring the stability of the tool. It would also help in tool-to-tool matching.

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WP 5: Fast Data Collection and Processing

With the move toward 450mm wafers, and the concomitant reduction in critical dimensions, the overall data and number of calculations increases dramatically. The goal of WP5 is to utilize off-the-shelf components in order to help in the configuration of a metrology-specific computer design.

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