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Applied Materials and A*STAR’s Institute of Microelectronics to Advance R&D in Fan-Out Wafer-Level Packaging

20 September, 2016

The organizations announce a five-year extension of their research collaboration at the Centre of Excellence in Advanced Packaging in Singapore
Fan-Out Wafer-Level Packaging is a key technology inflection in the semiconductor industry expected to help make chips and end-user devices smaller, faster and more power efficient
Joint R&D Centre set to meet growing demand for use of fan-out multi-die packaging in mobile devices

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